As a new-type foreign trade service provider driven by dual engines of technology commercialization and foreign trade services, HiSiaddi has established a "1+2+3+4=1" service system and can supply PI raw materials from multiple well-known original manufacturers.
As an R&D-focused foreign trade service provider, HiSiaddi does not only promote its own brands like single-brand factories. Instead, it objectively analyzes multiple high-market-share well-known PI brands from China and worldwide, and shares their major technological progress and breakthroughs, enabling buyers to access authentic, practical and up-to-date market information.
For more comprehensive and valuable PI market information, please contact HiSiaddi customer service.
Breakthrough highlights: China’s top five export manufacturers (Ruihua New Materials, Guofeng New Materials, Shidai Huaxian, Bomi Technology, Sichuan Aoniu) optimized chemical polymerization processes to realize mass production of high-end ultra-thin packaging PI, with dielectric constant Dk≤2.8 (1MHz) and dielectric loss Df=0.0035~0.006 (10GHz). Stable mass production of films ≤8μm thick with thickness tolerance ±2μm has been achieved, substituting Japanese ABF carrier tape substrates (Mitsubishi films) and filling the domestic gap in high-end packaging dielectric materials. Guofeng New Materials launched an AI intelligent casting production line with dynamically adjusted coating parameters via algorithms, boosting film yield by 12% and single-line production efficiency by 30%. Downstream procurement benefits:
1. Semiconductor packaging and testing buyers can switch to domestic PI to replace imported ABF, cutting per-square-meter substrate procurement costs by 22% without being tied to Japanese raw material delivery cycles;
2. QFN and COF carrier tape manufacturers achieve a 5% improvement in finished product yield, compatible with advanced packaging processes of 28nm and below, reducing chip warpage scrapping losses.
Breakthrough highlights: Joint molecular structure modification by Bomi Technology and Ruihua New Materials introduces photosensitive flexible groups to PI main chains, lowering PSPI curing temperature from traditional 320℃ to 200~250℃ and optimizing photolithography resolution to 2μm. This solves common defects of wafer warpage and solder ball detachment caused by high-temperature curing. The products have passed certifications from Hisilicon and Shenghe Jingwei, realizing mass domestic substitution of Japanese and American photolithography matching PI resins. Downstream procurement benefits:
1. Wafer foundry buyers can retain existing low-temperature production lines without purchasing additional high-temperature curing equipment, cutting single-wafer processing energy consumption by 18%;
2. Flexible OLED panel manufacturers adopt low-temperature PSPI as pixel isolation layers, lifting foldable screen bending life to over 200,000 cycles and reducing terminal screen failure rates.
Breakthrough highlights: Mass production of graphene composite PI by Shidai Huaxian and silicon carbide nano-modified PI by Ruihua New Materials launched. Conventional general PI has a thermal conductivity of 0.2W/(m·K), while modified products reach a maximum of 12W/(m·K) with volume resistivity maintained above 10¹⁶Ω·cm (unchanged insulation) and short-term temperature resistance of 480℃. Boron nitride filled CPI thermal films from Guofeng New Materials deliver a 40% reduction in coefficient of thermal expansion. Downstream procurement benefits:
1. New energy power battery and power semiconductor module buyers apply high thermal conductivity PI for insulation and heat isolation, improving battery heat dissipation efficiency, boosting module energy density by 18% and extending thermal runaway protection duration 3-fold;
2. SiC power device manufacturers adopt thinner insulating substrate materials, reducing device volume by 15%.
Breakthrough highlights: Mass production of fully fluorinated monomer modified CPI by Ruihua New Materials and Sichuan Aoniu achieves visible light transmittance ≥90%, yellowness index ≤3.0 and repeated bending resistance ≥200,000 cycles, breaking Ube Industries’ exclusive monopoly on transparent PI with stable yield ≥95%. Downstream procurement benefits: Foldable cover plate and optical sensor buyers shift to domestic sourcing, cutting CPI cover plate procurement costs by 30% compared with imported alternatives and reducing weight of terminal foldable mobile phone screens.
Breakthrough highlights: DuPont modified thermoplastic PI via bio-source monomer polymerization, with 35% renewable biomass raw materials. Water absorption rate dropped from 1.2% to 0.38%, injection molding temperature reduced by 40℃ and hydrolysis resistance improved by 65%. Friction coefficient of high-end aerospace PI composite panels decreased by 25%, suitable for mass production of aerospace hydraulic sealing parts. Downstream procurement benefits: Aerospace and automotive precision injection buyers achieve lower molding energy consumption and reduced failure rates of finished products exposed to water. Products comply with EU REACH low-carbon raw material certification, helping end products meet carbon footprint targets.
Breakthrough highlights: Mass production of fluorinated modified PI resin by UBE delivers Dk=2.21 and Df=0.0018 in the 28GHz millimeter wave band, below the traditional PI loss threshold of 0.003, with controllable film thickness down to 5μm for 6G radio frequency substrates. Downstream procurement benefits: Radio frequency antenna and millimeter wave module buyers reduce signal transmission loss, boosting transmission efficiency of terminal 6G communication equipment by 7% and shrinking antenna substrate thickness.
Breakthrough highlights: Upgraded molecular purification process for Kaneka medical PI limits metal ion precipitation in normal saline to ＜0.08ppm (far below FDA’s 1ppm limit), with no swelling after 180 days of immersion in human body fluid and elastic modulus reduced by 30%, suitable for implantable brain-computer electrode substrates. Downstream procurement benefits: Medical device buyers eliminate secondary surface coating procedures, cutting production costs of implant electrodes and lowering clinical failure rates of terminal medical equipment.
Breakthrough highlights: Toray’s new generation semiconductor PSPI delivers stable 1.5μm photolithography line width, 5% thermal weight loss temperature lifted to 520℃ and dimensional deformation ＜0.8% under high-temperature processes, applicable to temporary bonding films for 3D stacked advanced packaging. Downstream procurement benefits: Global advanced packaging and testing manufacturers reduce bonding scrapping rates by 4% and raise yield of high-end chip stacking processes.
Breakthrough highlights: Solvay’s aerospace energy storage PI dielectric material achieves discharge energy density of 8.9 J/cm³ at 200℃, retaining 92% breakdown strength after four breakdown cycles and 70% lower corrosion rate against space atomic oxygen, applied to aerospace thin-film capacitors. Downstream procurement benefits: Aerospace component buyers cut capacitor volume by 30% and reduce weight of satellite terminal energy storage modules.
1. Popularization of low-temperature imidization mass production processes: Domestic and overseas leading brands phase out high-temperature thermal imidization, cutting energy consumption by 25%. Overall factory prices of all PI categories decline by 12%~25%, optimizing comprehensive raw material costs for overseas buyers.
2. Commercialization of low-fluorine environmentally friendly modification technology: All halogen-free flame-retardant PI reaches UL94 V-0 standard, meeting EU and US new energy & electronics environmental access criteria and eliminating extra environmental compliance rectification costs for buyers.
3. Improved integrated composite forming technology: Bonding strength of PI + metal / ceramic composites increased by 50%, enabling downstream component manufacturers to remove bonding procedures, cutting 2~3 processing steps and compressing terminal manufacturing costs.
For more comprehensive and valuable PI market information, please contact HiSiaddi customer service.
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