As a new foreign trade service provider driven by both technology transformation and foreign trade services, HiSiaddi has built a "1+2+3+4=1" service system and can supply polymeric brominated epoxy resins sourced directly from multiple well-known original manufacturers. As a foreign trader with independent R&D capabilities, HiSiaddi has repeatedly proposed formula optimization schemes and application improvement suggestions for polymeric brominated epoxy resins through technological cooperation with factories and precise market insight. Below is a consulting case of formula optimization for polymeric brominated epoxy resins by HiSiaddi.
Contact HiSiaddi customer service for more formula optimization consulting support.
Client: Korea Circuit Tech A well-known high-end electronic substrate manufacturer in South Korea, specializing in high-Tg CCLs and high-frequency high-speed circuit board substrates. Its products are supplied to automotive electronics, industrial control and communication equipment divisions under Hyundai, Samsung and LG. Positioned in the mid-to-high-end market, the company strictly implements RoHS 2.0, REACH, PBDE-free, low ion contamination, high insulation, UL94 V-0 and other standards, with refined production control and extremely high requirements for raw material line compatibility and long-term finished product reliability.
The client had long purchased domestic polymeric brominated epoxy resin as the core flame retardant matrix resin for CCLs. After a period of mass production, continuous abnormal conditions emerged on the production line, which could not be completely eliminated despite repeated internal formula and equipment parameter adjustments. The client then entrusted HiSiaddi to conduct full-process technical diagnosis and problem rectification.
HiSiaddi coordinated technical staff from upstream resin manufacturers to conduct full-process troubleshooting covering batching, glue mixing, hot pressing and finished product inspection. Combined with raw material physical and chemical testing and formula review, four prominent technical problems were identified:
1. Poor compatibility of glue mixing system leading to glue delamination The polymeric brominated epoxy resin exhibited poor compatibility with curing agents, accelerators and organic solvents in the system. The prepared glue separated into distinct layers after short standing, resulting in uneven resin distribution on partial CCL areas, obvious color difference on board surfaces and large fluctuations in inter-batch bonding strength.
2. Glue overflow and edge material spillage during hot pressing The client adopted segmented high-temperature hot pressing processes. The wide softening point range of the existing resin caused uncontrolled fluidity under heat, leading to massive glue overflow at board edges, interlayer slippage and excessive board thickness deviation, greatly increasing edge trimming costs and defective product volumes.
3. Excessive ion content triggering hidden electrical performance hazards The insulation impedance of finished circuit boards continuously declined after high-low temperature cycling tests. Testing revealed excessive sodium and chloride ion residues in the resin, which easily formed micro-conductive channels under temperature and humidity fluctuations, creating risks of circuit corrosion and short circuits that failed to meet long-term service requirements for automotive electronics.
4. Inconsistent curing rate causing unstable board heat resistance The broad molecular weight distribution of the resin created uneven curing speeds across different areas of boards, resulting in obvious fluctuations in glass transition temperature (Tg) of finished products. Some batches failed to meet the client’s high heat resistance standards and could not pass end-product reliability tests.
Combining laboratory testing and process tracing, the root causes were clarified:
1. Inadequate post-treatment of the resin batch and insufficient molecular modification led to mismatched surface polarity with auxiliary agents, causing poor system compatibility.
2. Crude control of molecular weight during polymerization created a wide range, directly affecting the stability of softening point and curing rate.
3. Simplified water washing and purification processes left excessive inorganic salt ion residues.
4. Uneven resin end group structures further amplified fluidity defects under thermal processing conditions.
HiSiaddi adopted a three-dimensional solution integrating raw material performance optimization, formula system adjustment and production process calibration, and implemented rectification step by step with upstream and downstream technical teams.
We coordinated the resin manufacturer to upgrade production processes for supplied resins: optimize polymerization reaction parameters to precisely control molecular chain length, narrow molecular weight distribution and stabilize curing rate and softening point; adjust resin end group structures to lock softening point ranges and inhibit high-temperature glue overflow; upgrade multi-stage deionized water washing and vacuum purification processes to deeply remove salt impurities and control sodium & chloride ion content within 10ppm; perform molecular surface modification to improve compatibility with curing agents and solvents and resolve glue delamination issues. Optimized samples were delivered to the client for preliminary testing first.
Combined with the physical and chemical properties of optimized resin, we assisted the client in adjusting the overall formula: fine-tune the addition ratios of curing agents and accelerators, add special compatibilizers to enhance multi-component integration; optimize organic solvent ratios to improve glue system stability and extend uniform storage duration; slightly adjust filler proportions based on resin curing characteristics to further boost board bonding strength and heat resistance while maintaining unchanged flame retardancy.
1. Glue mixing procedure: Adjust stirring speed, mixing duration and feeding sequence, add low-speed pre-mixing to ensure full integration of resin and various auxiliary agents and avoid localized uneven mixing.
2. Hot pressing procedure: Reset segmented temperature, pressure and holding time for hot pressing based on the new flow characteristics of the resin to avoid excessive resin flow ranges and eliminate glue overflow and interlayer slippage.
3. Storage and feeding: Formulate exclusive raw material storage specifications requiring constant-temperature sealed storage to prevent resin moisture absorption and oxidative deterioration, and clarify the valid service period after opening to guarantee batch stability.
HiSiaddi assigned technical staff to stay on-site for follow-up of six consecutive batches of trial production, recording real-time glue status, hot pressing parameters and various finished product performance data. Faced with minor fluctuations during trial production, we quickly coordinated raw material factories to fine-tune process parameters. After two rounds of iterative optimization, all indicators stabilized and fully met standards.
1. Complete resolution of all technical issues Glue delamination was completely eliminated with greatly improved mixing uniformity; no glue overflow occurred during hot pressing and board thickness deviation was controlled within standard limits; ion content reached compliance standards with stable insulation impedance of finished products and no abnormalities after high-low temperature cycling tests; consistent Tg values across boards ensured stable heat resistance, flame retardancy and bonding strength fully meeting requirements for high-end automotive electronics. Production yield rose from 83% to 99.3%.
2. Standardized application solution delivered Combined with the client’s production line operating conditions, we compiled Technical Guidelines for Application of Polymeric Brominated Epoxy Resin in High-Tg CCLs, specifying formula ratios, equipment parameters and troubleshooting schemes to standardize the client’s operations.
3. Deepened cooperative relations The client highly recognized HiSiaddi’s technical service capabilities and designated optimized resin as its long-term primary raw material with steadily growing monthly procurement volume. Later, the client fully entrusted HiSiaddi with procurement and technical coordination for multiple electronic-grade flame retardant resins and special chemical raw materials, establishing an in-depth strategic partnership.
The technical problems encountered in this case were not simple product quality defects, but comprehensive technical failures arising from mismatched resin molecular structures, formula compatibility and production processes – typical pain points of high-end CCL manufacturers applying brominated epoxy resins.
Unlike ordinary traders who only deliver goods, HiSiaddi breaks technical barriers between raw material suppliers and end users, intervening in the full chain covering resin process upgrading, formula optimization and production line parameter calibration to accurately resolve technical issues. For foreign mid-to-high-end clients focusing on product reliability and production stability, professional supporting technical services are equally important as product quality. Relying on technical integration capabilities, HiSiaddi transcends the traditional trade model and becomes a trusted comprehensive solution provider of high-end electronic chemicals for clients.
Contact HiSiaddi customer service for more formula optimization consulting support.
+86-13120989737 
info@hisiaddi.com 
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